
更新時間:2023-03-28
產(chǎn)品品牌:
產品型號:VIT係列
矽片表麵形貌(mào)測量VIT係列
NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
表麵形貌測量/VIT係列(liè)/VITSA-10275853113.jpg)
片表麵形貌(mào)測量/VIT係列/VITC2C-10281860920.jpg)
3DIC TSV and BWS TTV矽片表麵形貌測量
Film Stress薄膜應力量測儀
FEOL Electrical Characterization 電學特性
Thin wafer metrology 晶圓測量學
Film Adhesion漆膜附著(zhe)力測試NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
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傳真:86-021-57656381
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